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 Semiconductor
RFL1N12, RFL1N15
1A, 120V and 150V, 1.9 Ohm, N-Channel Power MOSFETs
Description
These are N-Channel enhancement mode silicon gate power field effect transistors designed for applications such as switching regulators, switching converters, motor drivers, relay drivers and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits. Formerly developmental type TA09196.
January 1998
Features
* 1A, 120V and 150V * rDS(ON) = 1.9 * SOA is Power Dissipation Limited * Nanosecond Switching Speeds * Linear Transfer Characteristics * High Input Impedance * Majority Carrier Device * Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
Symbol
D
Ordering Information
PART NUMBER RFL1N12 RFL1N15 PACKAGE TO-205AF TO-205AF BRAND
G
S
RFL1N12 RFL1N15
NOTE: When ordering, use the entire part number.
Packaging
JEDEC TO-205AF
DRAIN (CASE) GATE
SOURCE
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures. Copyright
(c) Harris Corporation 1997
File Number
1444.2
5-1
RFL1N12, RFL1N15
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified RFL1N12 120 120 1 5 20 8.33 0.0667 -55 to 150 300 260 RFL1N15 150 150 1 5 20 8.33 0.0667 -55 to 150 300 260 UNITS V V A A V W W/oC oC
oC oC
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 1M) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Continuous Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ , TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 125oC.
Electrical Specifications
PARAMETER
TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS TEST CONDITIONS ID = 250A, VGS = 0V 120 150 VGS(TH) IDSS VGS = VDS, ID = 250A, (Figure 8) VDS = 0.8 x Rated BVDSS , TC = 25oC TC = 125oC VGS = 20V, VDS = 0V ID =1A, VGS =10V ID = 2A, VGS = 10V 2 400 VGS = 0V, VDS = 25V, f = 1MHz, (Figure 9) 17 30 30 30 4 1 25 100 1.9 6.3 1.9 25 45 45 50 200 80 25 15 V V V A A nA V V S ns ns ns ns pF pF pF
oC/W
MIN
TYP
MAX
UNITS
Drain to Source Breakdown Voltage RFL1N12 RFL1N15 Gate Threshold Voltage Zero Gate Voltage Drain Current
Gate to Source Leakage Current Drain to Source On Voltage (Note 2)
IGSS VDS(ON)
Drain to Source On Resistance (Note 2) Forward Transconductance (Note 2) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Thermal Resistance Junction to Case
rDS(ON) gfs td(ON) tr td(OFF) tf CISS COSS CRSS RJC
ID = 1A, VGS = 10V, (Figures 6, 7) ID = 1A, VDS = 10V, (Figure 10) ID 1A, VDD = 75V, RGS = 50 VGS = 10V, (Figures 11, 12, 13)
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage (Note 2) Reverse Recovery Time NOTE: 2. Pulse test: pulse width 300s maximum, duty cycle 2%. SYMBOL VSD trr ISD = 1A ISD = 1A, dISD/dt = 50A/s TEST CONDITIONS MIN TYP 150 MAX 1.4 UNITS V ns
5-2
RFL1N12, RFL1N15 Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 TC , CASE TEMPERATURE (oC) ID, DRAIN CURRENT (A) 1.0
Unless Otherwise Specified
1.5
0.5
0 25
50
75 100 125 TC, CASE TEMPERATURE (oC)
150
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE
10.00 OPERATION IN THIS AREA LIMITED BY rDS(ON) ID , DRAIN CURRENT (A) ID , DRAIN CURRENT (A) 1.00
4.0 3.5 3.0 2.5 2.0 1.5 1 VGS = 5V RFL1N12 RFL1N15 1000 0.5 VGS = 4V 0 1 100 10 VDS , DRAIN TO SOURCE VOLTAGE (V) 0 1 2 3 4 5 6 7 8 VDS , DRAIN TO SOURCE VOLTAGE (V) 9 10 VGS = 20V VGS = 10V VGS = 8V VGS = 7V VGS = 6V 250A PULSE TEST
0.10
0.01
FIGURE 3. FORWARD BIAS SAFE OPERATING AREA
FIGURE 4. SATURATION CHARACTERISTICS
3.0 2.5 ID , DRAIN CURRENT (A) TC = 25oC 2.0 1.5 1.0 0.5 0 0 2 4 6 8 10 12 VGS , GATE TO SOURCE VOLTAGE (V) 14 TC = -40oC TC = 125oC VDS = 12V 250A PULSE TEST DUTY CYCLE 2%
6 250A PULSE TEST DUTY CYCLE 2% rDS(ON) , DRAIN TO SOURCE ON RESISTANCE 5 TC = 125oC 4 3 TC = 25oC 2 TC = -40oC 1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ID , DRAIN CURRENT (A)
TC = 125oC
TC = -40oC
FIGURE 5. TRANSFER CHARACTERISTICS
FIGURE 6. DRAIN TO SOURCE ON RESISTANCE vs GATE VOLTAGE AND DRAIN CURRENT
5-3
RFL1N12, RFL1N15 Typical Performance Curves
2.0 NORMALIZED DRAIN TO SOURCE ON RESISTANCE VGS = 10V, ID = 1A NORMALIZED GATE THRESHOLD VOLTAGE (V)
Unless Otherwise Specified (Continued)
1.4 VGS = VDS, ID = 250A
1.5
1.2
1.0
1.0
0.5
0.8
0 -50
0
50
100
150
200
0 -50
0
50
100
150
200
TJ , JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 7. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 8. NORMALIZED GATE THRESHOLD vs JUNCTION TEMPERATURE
240 f = 1MHz 200 C, CAPACITANCE (pF) 160 120 CISS 80 COSS 40 CRSS 0 0 10 20 30 40 50 60 70 VDS , DRAIN TO SOURCE VOLTAGE (V) gf , TRANSCONDUCTANCE (S)
1200 VDS = 10V 1000 80s PULSE TEST 800 TC = 25oC 600 TC = 125oC 400 200 0 0 0.5 1.0 1.5 2.0 2.5 3.0 ID , DRAIN CURRENT (A)
TC = -40oC
FIGURE 9. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
FIGURE 10. TRANSCONDUCTANCE vs DRAIN CURRENT
150
BVDSS VDD = VDSS
10 VDD = VDSS 8 VGS , VOLTS (V) GATE TO SOURCE VOLTAGE RL = 75 IG(REF) = 0.095mA VGS = 10V 0.75VDSS 0.50VDSS 0.25VDSS DRAIN TO SOURCE VOLTAGE
112.5 VDS, VOLTS (V)
6
75
4
37.5
2
0 20
IG(REF) IG(ACT)
t, TIME (s)
80
IG(REF) IG(ACT)
0
NOTE: Refer to Harris Application Notes AN7254 and AN7260. FIGURE 11. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT
5-4
RFL1N12, RFL1N15 Test Circuits and Waveforms
VDD RL VDS VDS VGS 10% 10% 90% VGS 10% 50% PULSE WIDTH 50% tON tD(ON) tR 90% tOFF tD(OFF) tF 90%
0V
RGS
DUT
FIGURE 12. RESISTIVE SWITCHING TEST CIRCUIT
FIGURE 13. RESISTIVE SWITCHING WAVEFORMS
5-5


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